热导率
大金 adds thermal conductivity as a special characteristic in our broad line-up of products (plastics, 弹性体, 涂料, 油脂...) to help manage upcoming challenges in heat dissipation and transfer.
关于
The need for thermally conductive polymers
Polymer resins are versatile materials due to properties such as processability and relative strength. 然而, their relatively low thermal conductivity can present an engineering challenge when applied near a heat source or in metal replacement applications.
The required electrical properties of the resins vary depending on the application. Daikin offers both electrically-insulative and electrically-conductive solutions.
- - Performance and cooling of semiconductors / reliable electronics
The push to pack increasing amount of computing power into ever-smaller semiconductor packages, leads to an increasing engineering challenge to remove the dissipated heat from the electronic components.
With the advancement of 5G and high-frequency signals, there is a need to improve thermal conductivity of substrate materials while maintaining low dielectric properties for signal integrity.
- - 汽车 electrification
E-powertrain components such as motors, 逆变器, and battery packs generate less heat than combustion engines; however, their performance and safety are also more sensitive to temperature increases.
When designing these components, every layer’s thermal properties need to be considered to secure sufficient heat flow from source to sink.
- ——金属替代
Plastics are a good alternative to metals due to their lower tooling costs and design versatility. In some metal replacement applications through standard plastics, thermal conductivity is compromised. Plastics with high thermal conductivity are required.
我们的解决方案
Thermally-conductive, low Dk PFA resin (under development)
This material combines the outstanding properties of PFA resins (best-in-class thermal and chemical stability among melt-processable resins) with a high level of thermal conductivity, while maintaining the low dielectric of fluoro-materials. This unique proposition makes it an excellent material for electronics applications such as PCB substrates or films.
特征
- Electrical insulation : Best in class among plastics
- Dielectric properties : Low Dk, low Df
- 抗化学腐蚀 : Non-reactive to most chemicals
- 阻燃性 : UL94 V-0, critical oxygen index > 95%
热性能
测量 | 单位 | Dev. 年级 | 性病. 年级 | |
---|---|---|---|---|
热导率
|
Thru-plane |
W / m·K |
0.9 |
0.2 |
平面 |
2.8 |
- |
||
热阻 |
Thru-plane | m2·K/W | 3.3x10-3 | 10x10-3 |
测量 : Periodic radiant heating method
热导率 (W/m·K)= ρ×Cp × α, ρ:密度(公斤/米3), Cp: specific heat capacity (J/kg·K), α: Thermal diffusivity (m2·S-1)
热阻 : for 2mm, 1m2
The above numeric values are representative and not guaranteed.
其他属性
项 | 条件 | 单位 | Dev. 年级 | 性病. 年级 |
---|---|---|---|---|
Dk |
6 ghz |
- |
2.6 |
2.1 |
Df |
6 ghz | x10-4 | 9 | 3 |
体积电阻率 |
JIS K 6911 | Ω厘米 | ≧1016 | ≧1016 |
介电强度 |
IEC60243-1 / 1 mmt | 千伏/米 | 44 | 44 |
CTI |
IEC60112 / 3 mmt | V | 600 | 600 |
抗拉强度 |
ASTM D 638 | MPa | 27 | 20 |
断裂伸长率 | % | 3 | >100 | |
弯曲模量 | ASTM D 790 | 平均绩点 | 2.1 | 0.6 |
悬臂梁式冲击强度 |
ASTM D 256 (切口) |
J/m | 32 |
NB |
The above numeric values are representative and not guaranteed.
Thermally-conductive, tough PPS (under development)
PPS compound suitable for metal replacement applications due to its good balance between thermal and mechanical properties.
Material with excellent thermal conductivity and processability below 1mm wall thickness. Further customization of properties for specific applications also possible.
Thermal-physical properties
测量方向 | 单位 |
低变形类型 PPS |
高强度类型 PPS |
一般 PPS |
|
---|---|---|---|---|---|
热导率 |
在飞机 |
W / m·K |
12 |
13 |
0.3 |
通过飞机 | W / m·K | 2.5 | 2.5 | 0.3 |
测量 method : Laser flash method
热导率 (W/m·K)=ρ×Cp × α, ρ:密度(克/厘米3), Cp: specific heat capacity (J/g·K), α: Thermal diffusivity (m2/s)
The above numeric values are representative and not guaranteed.
Table of physical properties
In addition to the above thermal and physical properties, it has excellent heat reistance and mechanical properties.
项 | 条件 | 单位 |
低变形类型 PPS |
高强度类型 PPS |
---|---|---|---|---|
密度 |
ISO 1183 |
克/厘米3 |
1.7 |
1.7 |
抗拉强度 |
ISO 527 - 2 | MPa | 50 | 70 |
拉伸 |
% | 1.1 | 1.1 | |
抗弯强度 |
|
MPa | 80 | 100 |
弯曲模量 |
MPa | 16,000 | 20,000 | |
Charpy impact strength |
ISO 179 - 1、2 (无切口) |
kJ / m2 | 5 | 5 |
Heat deflection temperature (1.8 mpa) | ISO 75 - 2 | ℃ | 240 | 240 |
The above numeric values are representative and not guaranteed.
应用程序
Thermally-conductive materials are increasingly required for heat dissipation and removal in various industries such as automotive, electronics or aerospace. Each specific design requires a matching level of thermal conductivity in the appropriate carrier material.
在大金, we combine a broad portfolio of materials with our compounding expertise to provide excellent thermal conductivity without compromising the mechanical and chemical properties of fluoro-materials.