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热导率

大金 adds thermal conductivity as a special characteristic in our broad line-up of products (plastics, 弹性体, 涂料, 油脂...) to help manage upcoming challenges in heat dissipation and transfer.

关于

The need for thermally conductive polymers

Polymer resins are versatile materials due to properties such as processability and relative strength. 然而, their relatively low thermal conductivity can present an engineering challenge when applied near a heat source or in metal replacement applications.


The required electrical properties of the resins vary depending on the application. Daikin offers both electrically-insulative and electrically-conductive solutions.


  • - Performance and cooling of semiconductors / reliable electronics

The push to pack increasing amount of computing power into ever-smaller semiconductor packages, leads to an increasing engineering challenge to remove the dissipated heat from the electronic components.

With the advancement of 5G and high-frequency signals, there is a need to improve thermal conductivity of substrate materials while maintaining low dielectric properties for signal integrity.


  • - 汽车 electrification

E-powertrain components such as motors, 逆变器, and battery packs generate less heat than combustion engines; however, their performance and safety are also more sensitive to temperature increases.

When designing these components, every layer’s thermal properties need to be considered to secure sufficient heat flow from source to sink.


  • ——金属替代

Plastics are a good alternative to metals due to their lower tooling costs and design versatility. In some metal replacement applications through standard plastics, thermal conductivity is compromised. Plastics with high thermal conductivity are required.

我们的解决方案

Thermally-conductive, low Dk PFA resin (under development)

This material combines the outstanding properties of PFA resins (best-in-class thermal and chemical stability among melt-processable resins) with a high level of thermal conductivity, while maintaining the low dielectric of fluoro-materials. This unique proposition makes it an excellent material for electronics applications such as PCB substrates or films.

特征

- Electrical insulation : Best in class among plastics

- Dielectric properties : Low Dk, low Df

- Temperature resistance : CUT of 260℃

- 抗化学腐蚀 : Non-reactive to most chemicals

- 阻燃性 : UL94 V-0, critical oxygen index > 95%

TC_PFA_image1.png

热性能

测量 单位 Dev. 年级  性病. 年级

热导率


Thru-plane

W / m·K

0.9

0.2

平面

2.8

-

热阻

Thru-plane m2·K/W 3.3x10-3 10x10-3

测量 : Periodic radiant heating method

热导率 (W/m·K)= ρ×Cp × α, ρ:密度(公斤/米3), Cp: specific heat capacity (J/kg·K), α: Thermal diffusivity (mS-1)

热阻 : for 2mm, 1m2

The above numeric values are representative and not guaranteed.

TC_PFA_thermograph

其他属性

条件 单位 Dev. 年级 性病. 年级

Dk

6 ghz

-

2.6

2.1

Df

6 ghz x10-4 9 3

体积电阻率

JIS K 6911 Ω厘米 ≧1016 ≧1016

介电强度

IEC60243-1 / 1 mmt 千伏/米 44 44

CTI

IEC60112 / 3 mmt V 600 600

抗拉强度

ASTM D 638 MPa 27 20
断裂伸长率 % 3 >100
弯曲模量 ASTM D 790 平均绩点 2.1 0.6
悬臂梁式冲击强度

ASTM D 256

(切口)

J/m 32

NB

The above numeric values are representative and not guaranteed.

Thermally-conductive, tough PPS (under development)

PPS compound suitable for metal replacement applications due to its good balance between thermal and mechanical properties.

Material with excellent thermal conductivity and processability below 1mm wall thickness. Further customization of properties for specific applications also possible.

Thermal-physical properties

测量方向 单位

低变形类型

PPS

高强度类型

PPS

一般

PPS

热导率

在飞机

W / m·K

12

13

0.3

通过飞机 W / m·K 2.5 2.5 0.3

测量 method : Laser flash method

热导率 (W/m·K)=ρ×Cp × α, ρ:密度(克/厘米3), Cp: specific heat capacity (J/g·K), α: Thermal diffusivity (m2/s)

The above numeric values are representative and not guaranteed.

TC_PPS_thermograph

Table of physical properties

In addition to the above thermal and physical properties, it has excellent heat reistance and mechanical properties.

条件 单位

低变形类型

PPS

高强度类型

PPS

密度

ISO 1183

克/厘米3

1.7

1.7

抗拉强度

ISO 527 - 2 MPa 50 70

拉伸

% 1.1 1.1

抗弯强度


ISO 178
MPa 80 100

弯曲模量

MPa 16,000 20,000

Charpy impact strength

ISO 179 - 1、2

(无切口)

kJ / m2 5 5
Heat deflection temperature (1.8 mpa) ISO 75 - 2 240 240

The above numeric values are representative and not guaranteed.

应用程序

thermal-conductivity-automotive

thermal-conductivity-electronics.jpg

thermal-conductivity-aerospace.jpg

Thermally-conductive materials are increasingly required for heat dissipation and removal in various industries such as automotive, electronics or aerospace. Each specific design requires a matching level of thermal conductivity in the appropriate carrier material.

在大金, we combine a broad portfolio of materials with our compounding expertise to provide excellent thermal conductivity without compromising the mechanical and chemical properties of fluoro-materials.

  • 电机外壳
  • Inverter housings and PCB
  • 电池组
  • 热交换器
  • High-frequency PCB substrates
  • 天线外壳
  • 连接器
  • 航空电子设备外壳